2020. 2. 15. 09:59ㆍ카테고리 없음
Author by: Howard H. Manko Language: en Publisher by: Springer Science & Business Media Format Available: PDF, ePub, Mobi Total Read: 88 Total Download: 179 File Size: 54,5 Mb Description: Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more. Author by: RUDOLF STRAUSS Language: en Publisher by: Elsevier Format Available: PDF, ePub, Mobi Total Read: 89 Total Download: 321 File Size: 48,6 Mb Description: Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes.
Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes.
Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology Standard specifications have been fully updated New chapter covering Ball Grid Array (BGA) technology.
Soldering Handbook Pdf
Author by: Karl J. Puttlitz Language: en Publisher by: CRC Press Format Available: PDF, ePub, Mobi Total Read: 97 Total Download: 717 File Size: 51,9 Mb Description: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics. Author by: ASM International.
Smt Soldering Handbook Pdf
Handbook Committee Language: en Publisher by: Asm Intl Format Available: PDF, ePub, Mobi Total Read: 98 Total Download: 902 File Size: 53,8 Mb Description: Volume 6 is the most comprehensive reference book ever produced on the major joining technologies and their applications to engineered materials. With over 500 illustrations and 400 tables, this book includes practical advice on consumable selection and procedure development, as well as joining fundamentals, processes, assemblies and selection.
Aws Soldering Handbook Pdf
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology.
It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. Written by founding father of SMT technology.
Standard specifications have been fully updated. New chapter covering Ball Grid Array (BGA) technology.